PCB Via Loss & Impedance Calculator
Calculates Characteristic Impedance, Insertion Loss, and Thermal Rise based on geometry.
RF/Signal (Impedance)
Power/Thermal
Signal Geometry (RF)
Via Type
Single-Ended (Coaxial)
Differential Pair
Via Pad Diameter (mm)
~19.7 mils
Via Hole Diameter (mm)
~9.8 mils
Anti-pad Diameter (mm)
~31.5 mils
Via Length (Board Thickness) (mm)
~63 mils
Center-to-Center Spacing (mm)
~39.4 mils
Dielectric Constant (Dk)
Frequency (GHz)
Power Geometry (Thermal)
Current (Amps)
Hole Diameter (mm)
~11.8 mils
Plating Thickness (mm)
~1 mil (Standard)
Via Length (mm)
Conductivity (S/m) - Copper
Cross Section Visualization
RF Characteristics
Characteristic Impedance ($Z_0$):
-- Ω
Time Delay:
-- ps
Inductance ($L_{via}$):
-- nH
Capacitance ($C_{via}$):
-- pF
Insertion Loss ($S_{21}$):
-- dB
*Approximations based on coaxial wave theory.
Thermal & DC Characteristics
DC Resistance:
-- mΩ
Voltage Drop:
-- mV
Power Dissipated:
-- mW
Est. Temp Rise:
-- °C
*Temp rise based on IPC-2152 non-linear approximation. Assumes internal layer.